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Phenoxycycloposphazene
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Detail

Name

Phenoxycycloposphazene

Molecular Formula

C36H30N3O6P3

Molecular Weight

693.56

CAS Registry Number

1184-10-7

EINECS Number

208-127-2

Density

1.31

Melting point

116 ºC

Appearance

White to yellowish crystalline powder or particles

Conductivity(μS/cm)

≤30

Loss on drying

≤0.2%

Phosphorus content

13.4±0.5%

Nitrogen content

6±0.5%

HPLC Purity

≥99%

New type of halogen-free flame retardants, used in encapsulation Circuit board base material , resin etc.

Used for halogen-free flame retardant epoxy resin, products can be colorless and transparent.

Used in high-end PC, PC / ABS, PA, pet, PBT and PPO products.

Used for flame retardant of EMC epoxy encapsulants, epoxy composites, led, powder coatings,

potting materials, electronic and automotive parts.